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Memoria RAM LENOVO 32GB TRUDDR4 2933MHZ 2RX4 1.2V RD
4ZC7A08709
$1,632,171 + IVA 19%
Tax excluded
La memoria RAM LENOVO 32GB TRUDDR4 2933MHZ 2RX4 1.2V RD es la solución perfecta para mejorar el rendimiento de tu computadora. Con una velocidad de 2933MHz y una capacidad de 32GB, esta memoria RAM garantiza un funcionamiento rápido y eficiente. Además, su tecnología 2RX4 y voltaje de 1.2V la hacen una opción potente y confiable para cualquier usuario exigente. ¡Optimiza el rendimiento de tu equipo con la memoria RAM LENOVO!
La memoria RAM LENOVO 32GB TRUDDR4 2933MHZ 2RX4 1.2V RD es la solución perfecta para mejorar el rendimiento de tu computadora. Con una velocidad de 2933MHz y una capacidad de 32GB, esta memoria RAM garantiza un funcionamiento rápido y eficiente. Además, su tecnología 2RX4 y voltaje de 1.2V la hacen una opción potente y confiable para cualquier usuario exigente. ¡Optimiza el rendimiento de tu equipo con la memoria RAM LENOVO!
4ZC7A08709 MEMORIA 32GB TRUDDR4 2933MHZ
32GB TruDDR4 2933MHz 2Rx4 1.2V RDIMM
MEMORIA DE 32GB TruDDR4 2933MHz COMPATIBLE CON SERVIDORES QUE TIENEN PROCESADOR DE SEGUNDA GENERACION: SR530 - SR550 - SR570 - SR590 - SR570 - SR630 - SR650 Garantia de 01 AÑO(S) a través de CENTRO AUTORIZADO LENOVO SERVIDORES
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Lenovo 4ZC7A08709 módulo de memoria 32 GB 1 x 32 GB DDR4 2933 MHz
Módulos de memoria
ThinkSystem TruDDR4 Memory delivers trusted, tested, quality, performance, and reliability throughout the ThinkSystem portfolio. We use the highest quality industry-standard memory components sourced from Tier 1 DRAM suppliers. Only memory that meets these strict requirements are selected for TruDDR4 Memory. It is then compatibility tested and tuned on every ThinkSystem server to maximize reliability.
High Performance Memory
Lenovo offers high-performance and high-capacity memory options in ThinkSystem servers.
Persistent Memory
Lenovo ThinkSystem servers configured with Intel Optane DC Persistent Memory transforms the memory/storage hierarchy enabling faster insights from data. This breakthrough technology delivers large capacity, high speed, affordable memory with data persistence and advanced encryption capabilities. These DDR4 compatible modules significantly increase the capacity of available system memory, keeping more hot data closer to the CPU, and enabling greater operational efficiency by processing larger data sets with more user instances.
3DS RDIMMs
To meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.
Performance+ Memory
Memory intensive workloads needing a competitive advantage will benefit from Lenovo’s Performance+ memory. Lenovo engineers worked in partnership with leading memory suppliers to develop and tune ThinkSystem servers enabling them to exceed the latest industry standard for memory performance. Lenovo’s Performance+ memory delivers increased bandwidth and lower latency at 2933 MHz with memory all channels fully populated.
High Performance Memory
Lenovo offers high-performance and high-capacity memory options in ThinkSystem servers.
Persistent Memory
Lenovo ThinkSystem servers configured with Intel Optane DC Persistent Memory transforms the memory/storage hierarchy enabling faster insights from data. This breakthrough technology delivers large capacity, high speed, affordable memory with data persistence and advanced encryption capabilities. These DDR4 compatible modules significantly increase the capacity of available system memory, keeping more hot data closer to the CPU, and enabling greater operational efficiency by processing larger data sets with more user instances.
3DS RDIMMs
To meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.
Performance+ Memory
Memory intensive workloads needing a competitive advantage will benefit from Lenovo’s Performance+ memory. Lenovo engineers worked in partnership with leading memory suppliers to develop and tune ThinkSystem servers enabling them to exceed the latest industry standard for memory performance. Lenovo’s Performance+ memory delivers increased bandwidth and lower latency at 2933 MHz with memory all channels fully populated.
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